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Hot Selling Phone Cooler Heat Dissipation Plate Semiconductor Cooling Surface Amplifier Upgrade Third Gen Cooling Composite Heat Spreader

Hot Selling Phone Cooler Heat Dissipation Plate Semiconductor Cooling Surface Amplifier Upgrade Third Gen Cooling Composite Heat Spreader

Minimum order quantity (MOQ)
1
Supplier
东莞市捌佳壹电子科技有限公司
Supplier price (CNY)
¥3.1800

Price

from 48 ₽

Description

{"styleType":"offer-type-1","items":"889176566564,892224414561,890414984647,890031805654,890919888616,890544445918,890395440800,889982148072,889913765923","usemap":"_sdmap_0"} 新款第三代升级复合均热板 产品名称:复合均热板 产品规格:60*106*28mm 产品品类:普通款(搭配半导体散热背夹使用,背面材质导电硅纸) 磁吸款(通用磁吸款和背夹款散热器使用,背面材质双面胶) 使用方法:贴合至手机背面,搭配散热器使用,增加散热面积,达到给手机CPU以及摄像头降温。 磁吸款产品内部内嵌引磁片,无缝粘贴,磁吸款散热器可直接吸附使用。 注意须知:部分手机不适用,购买前,请先确认下机型是否可以使用,因不匹配等原因造成的损耗,我们不承担来回运费。

Specifications

Hot Selling Phone Cooler Heat Dissipation Plate Semiconductor Cooling Surface Amplifier Upgrade Third Gen Cooling Composite Heat Spreader | CHIFAT®