东莞厂家生产加工定制EB965A-HFA-Y2TG/KBG无铅锡膏，QFN爬升专用

描述

1. Sn-Ag-Cu 系列无铅焊锡膏。 Sn-Ag-Cu series lead free solder paste. 2. 抑制锡珠的产生。 Generate virtually no capillary ball. 3. 低腐蚀性助焊剂残留、展现出优越的电气性能。 Flux residue is non-corrosive and exhibits superior electrical properties. 4. 连续印刷经时变化小、具有稳定的印刷性能。 Exhibit excellent and stable printability over extended continuous printing. 5. 在 0.4mm 间距微小焊盘上，展现出优越的印刷性能。 Exhibit excellent printability for 0.4mm pitch fine pattern. 6. 无铅高温预温度曲线作业，润湿性能优良。 Exhibit excellent wetting in reflow soldering with PB-free specific high temperature reflow profile. 7. 提高耐热性能，即使高温预热也可展现出良好的润湿性。 Enhanced heat resistance allows excellent wettability even in high preheat temperature profile. 8. 助焊剂残留透明扩散均匀。 Flux residue is colorless and uniformly spread.

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